Professional Customized Audio Mainboard & PCBA Manufacturer
As a high-end custom audio expert, ZEH specializes in custom audio products, one-stop PCBA R&D/ speaker systems. Crafted with premium acoustic components, high-temperature-resistant PCBs, and high-performance main control chips, our solutions serve automotive devices, consumer electronics, AI voice smart audio, professional instruments, and intercom terminals—with deep customization for your unique appearance and functional needs.
Flexible Appearance Customization：Match product casing dimensions, integrate brand logos, and adopt special manufacturing processes to boost product recognition and brand differentiation.
Functional Customization & Integration：On-demand integration of core functions (Bluetooth, ANC, I/O interfaces, waterproofing, AI voice, multi-mode sound effects) to enhance your product’s market competitiveness.
- One-Stop R&D & Manufacturing: Full-process services (audio motherboard design, mold development, finished product assembly) eliminate multi-party coordination and streamline your development cycle.
- Reliable Quality Assurance: Rigorous acoustic performance and motherboard stability testing ensure long-term, stable operation across diverse scenarios.
Customize Audio PCBA & Mainboard Series
Our customized audio motherboards boast extensive applications, comprehensively covering all audio-enabled terminal products including the automotive equipment series, consumer electronics series, smart voice device series, AI voice device series, Bluetooth audio series, children’s audio product series, smart wearable product series, medical instrument equipment, pet device series, beauty equipment series, and household appliance series.
Tailored to the unique demands of different industry scenarios, we have built a functional modular customization system — based on the design logic of standardized core modules and optional extended functions. While ensuring core performance such as audio transmission stability and acoustic fidelity, it precisely matches the structural dimensions, appearance, and functional requirements of devices across various industries (e.g., anti-interference requirements for automotive scenarios, low-power consumption standards for medical equipment, and safety and compliance requirements for children’s products).
This approach not only flexibly controls the cost of motherboard customization (adding or removing audio modules such as Bluetooth, noise reduction, and AI voice interaction on demand to avoid waste from redundant functions) but also leverages a mature standardized customization process to help customers quickly complete product iteration and market launch.
Whether for consumer-grade smart devices, industrial-grade communication terminals, or professional medical instruments, our customized audio motherboards deliver the triple value of scenario-specific adaptation, stable and reliable performance, and balanced cost-efficiency, serving as the core hardware backbone for audio motherboards in industries worldwide.
Why Choose ZEH Audio Mainboard For Your Electronic Device Design?
In the dynamic landscape of diversified electronic device design, ZEH Audio motherboards stand out as the go-to solution for developers, underpinned by robust cross-scenario compatibility, specialized audio acoustic expertise, and a veteran technical team with deep industry know-how.
Our motherboards enable seamless circuit integration for a broad spectrum of devices—encompassing smart speakers, automotive infotainment systems, portable audio terminals, and mainstream consumer electronics. By accommodating product enclosures of varying dimensions and industry-specific form factors, they drastically reduce the structural adaptation hurdles inherent in full-device R&D, streamlining your development workflow.
Choosing a ZEH Audio motherboard delivers far more than a high-performance audio motherboard—it grants you a trusted development ally with dual expertise in design and acoustics. This partnership lets you fully focus on core innovation, freeing you from the burdens of troubleshooting and managing complex underlying hardware.
The Audio Mainboard & Motherboard Applications
Typical applications include passenger vehicle infotainment systems, commercial vehicle communication terminals, smart cockpit audio modules, in-car Bluetooth speakers, and EV voice interaction systems.Main requirements include electromagnetic interference resistance, stable performance under wide temperature ranges, seamless compatibility with vehicle central control systems, and low-latency audio transmission. Core Configurations & Advantages:Adopting IATF 16949-certified automotive-grade PCB materials and anti-interference chips, the motherboards support an operating temperature range of -40℃ to 85℃, making them suitable for extreme vehicle environments. They have passed EMC electromagnetic compatibility certification, effectively eliminating audio distortion caused by vehicle circuit interference and ensuring clear communication. Integrated with vehicle-mounted voice wake-up (wake-up rate ≥98%) and noise-canceling call functions, they perfectly meet the interaction needs of smart cockpit scenarios.
This range covers smart speakers, home audio systems, gaming peripheral audio modules, desktop Bluetooth speakers, and portable audio-visual devices. Key requirements for these products are high-fidelity sound quality, low power consumption, multi-function integration, and flexible cost control. Core Motherboard Configurations & Advantages:Equipped with high-end audio decoding chips, the motherboards feature a total harmonic distortion (THD) of <0.01% and a signal-to-noise ratio (SNR) of ≥110dB, delivering lossless audio reproduction. They support modular selection of EQ sound effect customization, wireless charging linkage, and multi-device interconnection functions, enabling cost control based on specific needs. Customization of miniaturized or special-shaped board layouts is available to accommodate the compact structural designs of various consumer electronics. The motherboards comply with relevant certification standards, ensuring seamless access to global consumer electronics markets.
This series comprises AI smart assistants, voice-controlled switches, smart access control voice modules, and far-field voice interaction terminals. Core requirements here include high-precision far-field voice recognition, resistance to ambient noise, low-latency response, and semantic interaction compatibility.Core Motherboard Configurations & Advantages:Integrated with proprietary patented noise reduction algorithms for multiple scenarios, the motherboards support far-field voice wake-up within a 5-20 meter range with a recognition accuracy rate of ≥95%, adapting to complex environments. They are equipped with low-power AI voice processing chips and support docking with mainstream voice assistant protocols for rapid function integration. The modular design allows for the addition or removal of multiple voice recognition and multi-round dialogue functions as needed, catering to different smart scenarios.
This lineup includes TWS true wireless earphones, Bluetooth transceivers, wireless audio adapters, and Bluetooth vehicle-mounted hands-free devices. Key requirements involve low-latency transmission, stable connections, long battery life, and miniaturized design.Core Motherboard Configurations & Advantages:Supporting Bluetooth 5.4 dual-mode (BLE/BR/EDR) transmission with latency as low as 30ms, the motherboards feature an optimized power management solution that extends battery life by 15%-20% compared to conventional industry motherboards, meeting all-day usage needs. They have obtained Bluetooth Special Interest Group (SIG) certification, ensuring stable connectivity and compatibility across multiple devices with a connection success rate of ≥99%.
Strengths of our company
Backed by over 25 years of proven expertise in the audio industry since 1998, we deliver precise tuning of frequency response curves, noise reduction algorithms, and sound profiles for key sectors including professional audio, smart homes, automotive applications, and consumer electronics. This addresses personalized needs such as high-fidelity playback and low-latency transmission. Through modular design to eliminate redundant functions, combined with in-house CNC equipment, sheet metal, and injection molding production lines, we achieve in-house supply of core components—reducing customization costs while accelerating time-to-market.
Our seasoned engineering team, with over 10 years of industry experience, provides end-to-end support covering chip selection, circuit design, firmware development, and mold customization. We enable hardware-software collaborative optimization to eliminate compatibility challenges. Complemented by a dedicated audio block design team and professional acoustic tuning specialists, our solutions support 8-channel high-definition audio output, ambient noise suppression, and other advanced features. Tailored to client requirements, our designs can meet Hi-Res Audio certification standards.
We leverage advanced manufacturing equipment including automatic diaphragm forming and semi-automatic welding systems, achieving motherboard precision of ±0.1mm. Coupled with an ISO-accredited quality management system and full-process inspections, we ensure consistency and reliability in mass production. Drawing on 8-layer 2-ounce copper circuit board technology—proven in high-end motherboards—we optimize power supply layouts and thermal dissipation structures. Paired with high-quality capacitors and isolated wiring, this enhances anti-interference capabilities and service life even in extreme environments.
We support seamless compatibility with wireless protocols such as Bluetooth, AI, and Wi-Fi, as well as multi-interface expansion including USB 3.2, HDMI, and DP. This facilitates seamless integration with a wide range of hardware devices, from smartphones and audio systems to medical instruments. Our dedicated after-sales team, with over 5 years of specialized experience, offers product maintenance, firmware updates, and technical consulting. We respond rapidly to clients’ personalized needs during installation and commissioning, ensuring long-term, stable partnerships.
FAQs
Customizing motherboards for kids’ devices centers on safety prioritization and child-centric scenario adaptability, adopting a standardized, targeted customization workflow to strike a seamless balance between functionality and protective capabilities. The detailed steps are as follows:
1. Define Core Product Requirements
First, map out the device’s intended use cases (e.g., early education devices, kids’ smartwatches, educational toys), functional modules (positioning, voice interaction, sensors), and safety benchmarks. Outline kid-specific safety requirements—including low radiation, interfaces compatible with food-grade materials, and short-circuit prevention—while validating compliance with relevant children’s safety certifications (e.g., China Compulsory Certificate (CCC) for children’s products).
2. Solution Customization & Prototype Development
Based on the defined requirements, engineers incorporate low-power chips into the motherboard architecture to extend battery life, integrate anti-misoperation circuit safeguards, and minimize the motherboard footprint to align with the compact form factors of kids’ devices. Following the finalization of the initial solution, a prototype motherboard is rapidly fabricated to validate functional compatibility, safety, and stability.
3. Testing & Mass Production Launch
Comprehensive multi-dimensional testing is imperative, covering safety voltage withstand tests, drop and shock resistance evaluations, and functional compatibility assessments to ensure full adherence to children’s product safety standards. Once all tests are passed, mass production can kick off. Additionally, dedicated after-sales technical support is provided to guarantee the long-term reliable operation of the motherboards.
The entire process is anchored in the unique needs of children’s usage scenarios, not only meeting the device’s functional demands but also fortifying a robust safety barrier.
